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Process |
Item |
Capability |
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Main information
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Layer |
1~12Layer |
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material |
FR4，CEM1，CEM3，Hight Tg，Halogen Free，FR1，Aluminum etc |
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Machining dimension (Max.) |
520mm*622mm |
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Board thickness (Min.) |
4-Layer 0.4mm(16mil) |
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6-Layer 0.8mm(32mil) |
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8-Layer 1.0mm(40mil) |
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10-Layer 1.2mm(48mil) |
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Board thickness (Max.) |
3.0mm |
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Finished thickness |
0.40mm~3.00mm |
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Finished thickness tolerance |
?10% |
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Finished tolerance(size) |
Piece |
? 0.127mm (5mil) |
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Panel |
? 0.20mm (8mil) |
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punch |
? 0.1mm (4mil) |
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Cu thickness |
Min.0.5oz(0.7mil)，Max.4oz(5.6mil) |
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Inter layer thickness (Min.) |
0.10mm |
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Conductor width /Conductor spacing(Min.)
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0.1mm(4mil) |
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Hole diameter(Min.) |
0.2mm(10mil) |
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Punching ( Min.) |
0.7mm(28mil) |
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Drilling |
Hole diameter tolerance |
PTH |
?.075mm |
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NPTH |
?.05mm |
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Hole location deviation |
?.075mm(3mil) |
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Spacing between hole and hole |
0.2mm |
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Circuit |
Conductor width /Conductor spacing deviation |
?20% |
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Circuit deviation |
≥ 0.1mm |
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Surface Finishing |
Several way |
Nickel / Nickel Immersion Gold / Gold-finger /OSP/HAL( Lead free) |
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Lamination |
Multilayer board precision between layer with layer |
8-Layet:0.1mm(4mil)Max. |
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CNC |
The slot size tolerance |
L:?.15mm(6mil) *L=length of slot |
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Slot width |
0.5mm (20mil) max. |
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scoring |
Remain thickness |
Board thickness 1/3 ?0.1 mm |
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Deviation |
?0.1 mm (4mil) |
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Panel dimension(Min.) |
60mm * 60mm |
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